Cheng, X., Yang, H., Jakubisin, D. J., Tripathi, N., Anderson, G., Wang, A. K., … Reed, J. H. (2022). 5G Physical Layer Resiliency Enhancements with NB-IoT Use Case Study. In MILCOM 2022 - 2022 IEEE Military Communications Conference (MILCOM) (pp. 379–384).
First name
D.
Middle name
J.
Last name
Jakubisin