"Streamlining Microelectronics Security and Testing"

The Joint University Microelectronics Program (JUMP 2.0) was established by the Semiconductor Research Corporation (SRC) in response to the rapid evolution of the semiconductor industry. The coalition is composed of universities, industry partners, and the Defense Advanced Research Projects Agency (DARPA). According to DARPA, JUMP 2.0 includes research centers focusing on several semiconductor-related technical challenges. Penn State leads one of these research centers, the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES). With the center, 14 universities, including Arizona State University (ASU), will collaborate to improve future microelectronics capabilities. CHIMES Director Madhavan Swaminathan says that exceptional growth requires new and transformative logic, memory, and interconnect technologies to combat the inevitable slowdown of the traditional dimensional scaling of semiconductors. Ira A. Fulton Schools of Engineering Fulton Professor of Microelectronics Krishnendu Chakrabarty leads ASU's contributions to the center, focusing on electrical testing and security. The focus of Chakrabarty's research will be on test and security functions in 3D integration, which involves vertically connecting semiconductor devices, and heterogeneous integration that combines semiconductors manufactured in multiple locations into a single device. In addition, to ease security concerns, CHIMES researchers will examine methods for preventing the exposure of stolen intellectual property to adversaries and for deterring hardware Trojans. A hardware Trojan is an adversary's act of physical sabotage that causes a computer chip to malfunction. This article continues to discuss the efforts to streamline microelectronics security and testing.

Arizona State University reports "Streamlining Microelectronics Security and Testing"