EDAML 2022 Invited Speaker 8: Machine Learning for Cross-Layer Reliability and Security
Author
Abstract

In the deep nano-scale regime, reliability has emerged as one of the major design issues for high-density integrated systems. Among others, key reliability-related issues are soft errors, high temperature, and aging effects (e.g., NBTI-Negative Bias Temperature Instability), which jeopardize the correct applications' execution. Tremendous amount of research effort has been invested at individual system layers. Moreover, in the era of growing cyber-security threats, modern computing systems experience a wide range of security threats at different layers of the software and hardware stacks. However, considering the escalating reliability and security costs, designing a highly reliable and secure system would require engaging multiple system layers (i.e. both hardware and software) to achieve cost-effective robustness. This talk provides an overview of important reliability issues, prominent state-of-the-art techniques, and various hardwaresoftware collaborative reliability modeling and optimization techniques developed at our lab, with a focus on the recent works on ML-based reliability techniques. Afterwards, this talk will also discuss how advanced ML techniques can be leveraged to devise new types of hardware security attacks, for instance on logic locked circuits. Towards the end of the talk, I will also give a quick pitch on the reliability and security challenges for the embedded machine learning (ML) on resource/energy-constrained devices subjected to unpredictable and harsh scenarios.

Year of Publication
2022
Conference Name
2022 IEEE International Parallel and Distributed Processing Symposium Workshops (IPDPSW)
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